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Semiconductor Dedicated of Hydrostatic Wafer Grinder

Model: GTR-1215

Category: Electronic Production Manufacturing Equipment

Exhibitor: GRINTIMATE PRECISION INDUSTRY CO., LTD.

Booth No: N510

Characteristic

*Won the 2023 Taiwan Excellence Award.
*Online Monitor of Grinding status, prevent the wafer from being deformed and damaged.
*Real-time monitoring of wafer thickness and automatic correction to ensure the accuracy of wafer thickness.
*Chuck table could be customized according to the needs of different sizes wafers.
*Achieve 300mm Si wafer thinning thickness <100µm, TTV <2µm, Ra 0.01µm
*Especially designed for widely used in high hardness plane materials, rapid thinning, and achieve the effect of flattening.
*Optional granite base.

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