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Coreless Detach Machine(with warpage leveling)

Category: Electronic Production Manufacturing Equipment

Exhibitor: RAINBOW MST INC.

Booth No: N218

Characteristic

This equipment is designed for the DCF layer and substrate of automatic depaneling products without chips (such as ETS, MIS, etc.). By cutting only the corners of the product, it minimizes damage to the product and allows for substrate depaneling in a way that does not cause warping. However, if needed, warping can be corrected by installing a warping correction module.

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