Wafer Grinder with EFEM

Model: GTR-1215A

Category: Electronic Production Manufacturing Equipment

Exhibitor: GRINTIMATE PRECISION INDUSTRY CO., LTD.

Booth No: N510

Characteristic

*Compatible with 4-12inch wafer grinding. Our system monitors grinding loads while grinding. This prevents workpiece deformation and damage caused by excessive pressure during the process.
*The size of the chuck can be customized according to customer needs, meeting the grinding and thinning process requirements of different sizes of semiconductor materials.
*Real-time monitoring and automatic correction to ensure the accuracy of wafer thickness.
*Automatic wafer loading and unloading. Other devices such as Loadport, Wafer Robot, Aligner and cleaning system can all be customized according to the customer's requirements.
*Adding Adaptive Control system to the controller's upgraded software, providing stable grinding pressure and enhancing surface precision.
*We also develop equipment software, with a visual interface, various applications and support for SECS/GEM.

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Wafer Grinder with EFEM

Characteristic

Other Products

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