E2 FOPLP & Advanced Fanout Packaging Solutions Seminar Register Seminar Schedule
Date: 2025/4/16 (Wed.) 13:30 - 16:10
Venue: Room 402c, Taipei Nangang Exhibition Center, Hall 1
Fee: Free
Schedule
Date
Topic
Company
Language
15:10 - 15:40
National Sun Yat-sen University, Department of Mechanical and Electro-Mechanical Engineering
CH
15:40 - 16:10
Contrel Technology Co,. Ltd.
CH
Speakers
-
Simon Tu
Chief
Equipment Development Committee, TPSA
-
VIP Address
Shih-Chieh Chang
General Director
Electronic and Optoelectronic System Research Laboratories, ITRI
-
Teck Lee
Technical Director
ASE Group
-
Semiconductor Packaging FOPLP: Technological Innovations
Cheng-Ta Ko
Director
Unimicron
-
Panel Level Packaging: The Opportunities and Challenges
Wei Yuan Cheng
Deputy Director
Innolux Corporation
-
Thermal and Mechanical Characterization Analysis of Advanced Packaging
Meng-Kai Shih
Assistant Professor
National Sun Yat-sen University, Department of Mechanical and Electro-Mechanical Engineering
-
Application of Laser Processing Technology in Fan-Out Packaging Processes
Aaron Hsu
Director
Contrel Technology Co,. Ltd.