• Wei Yuan Cheng

     

    Deputy Director

    Innolux Corporation

     

     

    Topic

     

    Panel Level Packaging: The Opportunities and Challenges

     

    Speaker Profile

     

    Experience：
    INNOLUX Product Technology Development Division Senior Manager
    ITRI EOSL Deputy Industrialization Director

     

    Outline

     

    With the rapid development of AI artificial intelligence technology and applications, the demand for high speed computing drives the integration of heterogeneous chips and towards to larger package sizes. Comparing to wafer-level packaging, panel-level packaging will be more suitable for large-size chip packaging because it adopts a square carrier. In this topic, we will introduce the opportunities and challenges of panel-level packaging from Innolux perspective.