• Meng-Kai Shih

     

    Assistant Professor

    National Sun Yat-sen University, Department of Mechanical and Electro-Mechanical Engineering

     

     

    Topic

     

    Thermal and Mechanical Characterization Analysis of Advanced Packaging

     

    Speaker Profile

     

    Experience：
    - 2007-2011 ASE (Advanced Semiconductor Engineering)
    - 2011-2013 CORNING
    - 2013-2015 USI (Universal Scientific Industrial)
    - 2015-2020/1 ASE
    - 2020/2-2024/7 National Formosa University
    - 2024/8 National Sun Yat-sen University

     

    Outline

     

    Advanced packaging technology is widely applied in high-performance computing (HPC), artificial intelligence (AI), and cloud storage. Through heterogeneous integration, chips manufactured using different processes are packaged into a single module to enhance performance and optimize system integration. The leading technologies in this field include 2.5D IC packaging, fan-out chip-on-substrate (FOCoS) packaging, and chip-last packaging. These techniques utilize silicon interposers or fan-out (FO) technology to integrate application-specific integrated circuits (ASICs) with high-bandwidth memory (HBM), improving signal transmission efficiency and reducing power consumption. However, as packaging technology continues to evolve, thermal management and mechanical stability have become critical challenges affecting packaging reliability. Through comprehensive thermal and mechanical analysis, the practical performance of advanced packaging can be assessed, enabling further structural optimization to enhance reliability and efficiency, ensuring stable applications in high-performance computing, AI processing, and next-generation communication technologies.