• Aaron Hsu

     

    Director

    Contrel Technology Co,. Ltd.

     

     

    Topic

     

    Application of Laser Processing Technology in Fan-Out Packaging Processes

     

    Speaker Profile

     

    Experience：
    1. Contrel Technology, Laser R&D Center, Senior Director, 2018.07~
    2. Coretronic. CTO office, Special Assistant, 2017.12-2018.06
    3. National Applied Research Laboratories, Instrument Technology Research Center, Research Fellow and Director, 2009.01-2017.12
    4. National Applied Research Laboratories, Instrument Technology Research Center, Associate Researcher, 2004.01-2008.12

     

    Outline

     

    The application of fan-out packaging technology is becoming increasingly widespread, especially in the fields of semiconductors, displays, and wearable devices. With the growing demand for miniaturization, high performance, and high integration, this technology will continue to drive the development of related industries. Laser processing technology plays a crucial role in fan-out packaging, from precision cutting to efficient bonding and debonding, as well as substrate edge trimming and RDL repair. Laser technology has made a significant contribution to improving packaging efficiency and yield.