• Cheng-Ta Ko

     

    Director

    Unimicron

     

     

    Topic

     

    Semiconductor Packaging FOPLP: Technological Innovations

     

    Speaker Profile

     

    Cheng-Ta Ko received his Ph.D. degree in Electronics Engineering from National Chiao Tung University, and M.S. degree in Chemical Engineering from National Taiwan University. From 2002-2015, he worked as a senior engineer and department manager at the Electronics and Optoelectronic Research Laboratories, Industrial Technology Research Institute (ITRI). Since 2015 he has served in Unimicron, and is currently the Director and in charge of the New Business Development Division under CEO Office. His research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and IC substrate. He is currently in charge of the Panel RDL, Glass Core, and Hybrid Substrate technology development.

     

    Outline

     

    The FOPLP (Fan-Out Panel Level Packaging) technology revolutionizes chip packaging efficiency and cost-effectiveness. By using rectangular panels instead of traditional circular wafers, FOPLP increases material utilization and reduces material waste during production. The fan-out routing design effectively reduces signal delay, enhances electrical performance, and improves heat dissipation, making it suitable for high-performance computing and artificial intelligence applications. Additionally, FOPLP technology supports chip miniaturization, meeting the needs of mobile devices and wearable gadgets. Although current challenges include panel warpage, uniformity, and yield rate, global leading companies are actively investing in development and expect to achieve mass production in the coming years.