Thermal and Mechanical Characterization Analysis of Advanced Packaging

Date: 15:10 - 15:40

Language: CH

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  Meng-Kai Shih

   

  Assistant Professor

  National Sun Yat-sen University, Department of Mechanical and Electro-Mechanical Engineering

   

   

  Speaker Profile

   

  Experience：
  - 2007-2011 ASE (Advanced Semiconductor Engineering)
  - 2011-2013 CORNING
  - 2013-2015 USI (Universal Scientific Industrial)
  - 2015-2020/1 ASE
  - 2020/2-2024/7 National Formosa University
  - 2024/8 National Sun Yat-sen University