Simon Tu

Chief

Equipment Development Committee, TPSA

VIP Address

Shih-Chieh Chang

General Director

Electronic and Optoelectronic System Research Laboratories, ITRI

Teck Lee

Technical Director

ASE Group

Semiconductor Packaging FOPLP: Technological Innovations

Cheng-Ta Ko

Director

Unimicron

Panel Level Packaging: The Opportunities and Challenges

Wei Yuan Cheng

Deputy Director

Innolux Corporation

Thermal and Mechanical Characterization Analysis of Advanced Packaging

Meng-Kai Shih

Assistant Professor

National Sun Yat-sen University, Department of Mechanical and Electro-Mechanical Engineering

Application of Laser Processing Technology in Fan-Out Packaging Processes

Aaron Hsu

Director

Contrel Technology Co,. Ltd.