T3 Panel-Level Packaging Forum: Process and Materials Register Seminar Schedule
Date: 2025/4/17 (Thu.) 13:35-16:10
Venue: Room 403, Nangang Exhibition Center Hall 1
Fee: NT$3,000
Schedule
Speakers
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Opening Remarks
Jacob Lin
CTO
MCL, Industrial Technology Research Institute
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Advanced Packaging Solutions and Applications with FOPLP Technology
Jim Lin
Vice President
Powertech Technology Inc.
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FOPLP Technologies and Applications
George Lin
Senior Director of Advanced Package Business Center
Innolux Corporation
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FOPLP and TGV Process Issues and Inspection Techniques
Kerson Wang
General Manager
iboson Technology Co., Ltd.
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Corning Glass Innovations for Advanced Packaging in the Age of AI
Peter Lee
Product Line Manager, Advanced Packaging Solutions
Corning Incorporated
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Photosensitive Materials Supporting Diverse Solutions for the FOPLP Industry
Yi-Jin Chen
Asst. Manager, R&D
Everlight Chemical Industrial Corporation
Registration info.
Taiwan Display Materials & Devices Association (TDMDA)
Vivian Tel: 886-3-5821699 ext 10 E-mail: YilingHe@tdmda.org.tw
Shally Tel: 886-3-5821699 ext 12 E-mail: ShallyChen@tdmda.org.tw
Organizers
Taiwan Display Materials & Devices Association (TDMDA)
Co-Organizers
Taiwan Display Union Association (TDUA)