• George Lin

     

    Senior Director of Advanced Package Business Center

    Innolux Corporation

     

     

    Topic

     

    FOPLP Technologies and Applications

     

    Speaker Profile

     

    Experience：
    Chi-Mei Optoelectronic Monitor Product Management Manager
    Aussmak Optoelectronic General Manager
    Ampletec Product Management Manager

     

    Outline

     

    As the demand for high-bandwidth memory (HBM) continues to grow in large-scale chips for AI, HPC, and edge computing, the focus of advanced semiconductor packaging technology is gradually shifting from wafer-based to panel-based solutions, a trend that is becoming increasingly evident. This transition also presents significant challenges, particularly in substrate material evolution. The shift from traditional silicon wafer substrates to glass substrates has led to a decline in familiarity with existing technologies, materials, and equipment within the semiconductor industry. Key technical challenges include the precision control of large-size substrates, warpage management, and differences in the coefficient of thermal expansion between heterogeneous materials, all of which require urgent solutions. Additionally, as advanced packaging structures and processes continue to innovate, the complexity of Fan-Out Panel Level Packaging (FOPLP) development has significantly increased.
    Innolux has been deeply engaged in FOPLP technology for more than eight years, actively filing patents in various structures and processes. Since 2022, the company has made substantial capital investments in establishing FOPLP production lines and has collaborated with the world's top ten IC companies to jointly develop the latest FOPLP structures and technologies. Leveraging its technical expertise in flat-panel displays, Innolux has integrated high-yield fine-pitch manufacturing on glass substrates and AOI (Automated Optical Inspection) capabilities into FOPLP. This strategic application has successfully revitalized existing display production facilities, unlocking new value and opportunities for these assets.