Advanced Packaging Solutions and Applications with FOPLP Technology

Date: 13:40-14:10

Language: CH

• 

  Jim Lin

   

  Vice President

  Powertech Technology Inc.

   

   

  Speaker Profile

   

  Education:
  Ph. D. Power mechanical department, National Tsing Hua University
  
  Experience:
  Advanced Packaging Operation AVP of Powertech Technology Inc.
  Advanced Packaging BU head of Powertech Technology Inc.
  Board Director of Greatek Electronics Inc.