• Kerson Wang

     

    General Manager

    iboson Technology Co., Ltd.

     

     

    Topic

     

    FOPLP and TGV Process Issues and Inspection Techniques

     

    Speaker Profile

     

    Education:
    National Chiao Tung University - Institute of Physics

    Experience:
    Epistar: LED Epitaxy engineer
    AUO: Cell Process/Process Development engineer
    AUO: RD Lab/Measurement Technology Development/Standard Manager
    3DIDA Association: Director

    Incumbent:
    iboson Technology General Manager
    Taiwan Display and Application Industry Association TPSA Expert Technical Committee Member - Flat Panel Display Group Member
    SEMI FPD committee leader

    Awards:
    SEMI Standards Member Contribution Award

     

    Outline

     

    Fan-Out Panel Level Packaging (FOPLP) and Through Glass Via (TGV) are key components of advanced packaging technology, both with high potential in performance characteristics and cost reduction. This presentation will focus on the technical challenges and inspection methods in the FOPLP and TGV processes.

    Summary of Topics:
    • Problems in the FOPLP process
    • Challenges in TGV processing
    • Short circuits and abnormal hot spots
    • Non-destructive testing for advanced packaging applications

    This presentation will provide in-depth insights and practical recommendations to help the industry address process challenges and contribute to technological breakthroughs in improving process yield.