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YAYATECH Post-Dicing IR Inspection Equipment

Model: YAYATECH DSI-3000T

Category: Semiconductor Package Equipment

Exhibitor: SCIENTECH CORPORATION

Booth No: N/A

Characteristic

1). Patented Liquid Medium System:
Equipped with an exclusive patented system that enables high-resolution IR imaging through dicing tape.

2). Immediate Through-Tape Detection:
Allows for instant IR inspection of inner cracks and inner chipping at the Chiplet level immediately after wafer singulation.

3). Cost Saving & Yield Improvement:
Specifically designed for Heterogeneous Packaging to detect internal defects early, preventing further loss and significantly increasing overall production yield.

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