Semiconductor Glass Laser Cutting
Category: Panel-Level Packaging (PLP) Equipment / Material
Exhibitor: CONTREL TECHNOLOGY CO., LTD.
Booth No: M210
Characteristic
Ultrashort Pulse Laser Glass Cutting Technology for cutting hard and brittle transparent materials
●Low surface roughness
●Excellent edge quality
●Cutting speed : ≧ 500 mm / sec
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