600mm PLP FOUP
Model: GL-PF600
Category: Panel-Level Packaging (PLP) Equipment / Material
Exhibitor: CHUNG KING ENTERPRISE CO., LTD.
Booth No: L128
Characteristic
The Panel FOUP 600x600 is designed to carry glass panels, PCB substrates, and glass core substrates, making it ideal for panel-level fan-out packaging processes. It supports large-area and ultra-thin carriers with a customizable large-size, multi-layer design, significantly reducing process costs. Featuring automation-friendly capabilities, including AMHS transport, loading, and mechanical opening, it meets the customized needs of emerging technologies and specialized processes. The Panel FOUP 600x600 is the ultimate automation solution for heterogeneous integration.
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