Bonding/Debonding Equipment
Model: Invisi LUM-XBD Series
Exhibitor: SHIN-ETSU SILICONE TAIWAN CO., LTD.
Booth No: M308
Characteristic
Assured and high-precision collective chip transfer from Shin-Etsu Donor Plate to Shin-Etsu Release Plate.
Collective transfer available for various shapes of chips. Automation of debonding process.
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High-Speed Repair Equipment (Trimming/Repair Equipment)
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Release Plate SQRP Series
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Donor Plate (SQDP Series)
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Multi Laser Lift Off Equipment (U/Excimer Laser)
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