Mingyao Semiconductor Technology recently announced the launch of a single-sided multi-layer aluminum-based circuit board using a hybrid process. The perfect balance of cost is achieved, meeting the needs of complex lines with the price of destruction.

The process released this time not only retains the original electrical performance. Through the optimization process, the operating temperature is reduced by nearly 8-10°C at 100°C, making it suitable for application fields such as high-density LED direct-down light panels, vehicle-mounted high-brightness displays, and industrial control screens.

The product still adopts the structural design of exclusive copper paste printing and combines precise thermal/electrical layout, which not only improves the overall thermal conductivity, but also maintains its durability while meeting the layout requirements of complex circuits. At the same time, the production cost is reduced by more than 30%, which solves the problem of aluminum-based multi-layer circuit boards that limit their wide application due to high costs.

At present, this single-sided multi-layer motherboard has passed the verification test of the most advanced automobile manufacturers, evaluating areas such as automotive HUD (head-wiping display) and high-brightness wood grain screens. Ceramic substrate circuit boards provide a better choice for application scenarios with high temperature and high precision requirements.

This release once again reflects the core position of Mingyao Semiconductor in technological innovation and market orientation. In the future, it will continue to be committed to developing high-performance, highly environmentally friendly circuit board technology and promote the development of derivative industries in the direction of green technology.