「【L1】2024 國際Micro/Mini LED Display高峰論壇」將邀請到XTPL的專家－－Marcin Cinkowski，親自來跟XTPL於MicroLED上的技術突破。內容精彩，您不容錯過。

更多資訊請上：https://www.tdua.org.tw/event.php?act=view&id=49

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The case of Ultra-Precise Dispensing direct printing of metals and dielectrics! 🔬🌍

We are very pleased to announce that scientists H.K. Trieu, L. Rennpferdt, S. Bohne from the Institute of Microsystems Technology at the University of Technology in Hamburg (TUHH) discovered UPD applications within MEMS.

🔬 Case: Contact pads were written on the unstructured substrate surface on the input and output sides and between the trenches to investigate the conductivity at different positions.

🟢 Delta Printing System used to write conductive paths.

🟢 Printing material: #XTPL CL85 Ag Nanopaste.

🟢 Printing nozzle with an orifice of 5 μm.

🟢After printing, the substrate including the written structures was sintered on a hot plate at 200°C for 20 minutes.

💯 Results:

A conductive connection across all trenches was successfully established. The presented experiment shows that UPD printing of conductive structures on 3D patterned fused silica substrates with significant surface roughness is feasible. So far, only silver is available as a conductive material in the form of nanopaste. This proof-of-principle also demonstrates the relevance of this technology for the 3D patterning of MEMS. In addition to electrical circuits on complex surfaces, this technology can potentially be used to realize interconnects between stacked layers 🟰🟰🟰

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XTPL & QustomDot are pioneering flexible microLED displays in the EU-funded BAMBAM Horizon Europe* project.

They successfully tested a new generation of InP-based quantum dot (QD) inks, showcasing the potential to disrupt the microLED display sector.

 The experiments showcase the excellent compatibility of QustomDot's unique red and green inks with XTPL’s state-of-the-art Delta Printing System. QD inks were deposited with unparalleled precision, accuracy and uniformity, as attested by a reproducibility of the deposited droplet diameter is 3,5 µm and its height below 300 nm – well within the requirements for microLED. Being able to do this on both hydrophobic and hydrophilic surfaces, our solution further highlights the versatility towards different integration flows. The prints are capable of satisfying the current demands for display printing and the prospective requirements for manufacturing microLEDs. The combined impact of XTPL’s printing system and QustomDot’s QD inks indicates that this technology is incredibly versatile, and presents exciting opportunities for expanding the use of QD-based ink printing on a larger scale. The results have been nothing short of spectacular!

* The BAMBAM project is funded under Horizon Europe Grant Agreement n°101070085. We thank the European Union for its support. Views and opinions expressed are those of the author(s) only and do not necessarily reflect those of the European Union. Neither the European Union nor the granting authority can be held responsible for them.

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XTPL offers Ultra-Precise Dispensing System, which is a single nozzle solution tailored for the integration with manufacturing equipment for production lines of advanced electronics. The high precision dispensing system of XTPL significantly impacts two major application fields: heterogeneous integration and yield management and has the potential to complement conventional techniques in microelectronics manufacturing. This means that the unprecedented precision in the 0.50-10 micrometre range offered by XTPL can be used on a mass scale across many industries.

“Advancements in microelectronics are transforming how we connect and perceive the world around us. XTPL provides ultra-precise dispensing technology for microelectronics, which answers the demands of additive manufacturing and constant microelectronics miniaturization. We are focusing on four market segments including consumer electronics with rapidly developing VR technology, healthcare industry, next-gen displays for automotive and airspace industries and research institutes.” – said – Filip Granek CEO at XTPL.

The UPD technology allows ultra-precise dispensing of conductive traces over the edge, facilitating the integration of heterogeneous elements, enabling the integration of various electronic components or devices into a single system or package

It also provides ultra-precise dispensing of conductive microbumps for 3D integrated circuits, advanced packaging, or system-on-chip designs, where compact and high-density interconnections are essential. The controlled and precise placement of microbumps (below 50 um diameter) allows for improved performance, increased functionality, and reduced form factor in heterogeneous systems.

UPD technology allows ultra-precise dispensing of conductive or insulating material to the microvias for advanced packaging techniques like flip-chip and through-silicon via (TSV) technologies to establish connections between different layers facilitating communication between stacked components or dies. Via filling enables efficient connections, thermal management, and miniaturization, providing enhanced functionality and performance in advanced packaging applications.

UPD offers ultra-precise dispensing of conductive interconnections with microLEDs enabling their integration into heterogeneous microelectronic systems. The interconnections facilitate the control, driving, and power distribution to the microLEDs, ensuring their proper functionality within the overall display system and opening up possibilities for applications such as AR/VR devices, smartwatches, automotive displays, and more.

This solution finds application in the broadly understood additive manufacturing industry with a particular focus on microelectronics and microelectronics component manufacturers, including, but not limited to OLED and MicroLED displays, semiconductors, advanced PCBs or in the healthcare industry. UPD technology can also be used in R&D departments and development and academic centers working on solutions using additive micro-scale printing technology.