PX3000™ Custom 3D AOI Inspection System for Advanced Packaging

 

產品分類：先進設備 - 先進封裝&3D IC

廠商名稱：美商速博光學股份有限公司台灣分公司

攤位號碼：M533

 

產品特色

 

Custom 3D AOI Inspection System for Advanced Packaging
The Ultimate Combination of High Speed, High Accuracy and High Resolution
for Dual-Sided 3D AOI for Advanced Packaging in JEDEC Trays

PX3000™
The Ultimate in Speed and Accuracy High Precision Accuracy with Multi-Reflection Suppression™ (MRS™) Sensor Technology
The PX3000 is powered by CyberOptics’ breakthrough 3D sensing technology comprised of two MRS Sensors for semiconductor advanced packaging inspection and metrology. PX3000 offers unmatched accuracy powered by the revolutionary MRS technology by meticulously identifying and rejecting reflection-based distortions caused by shiny components and surfaces.
Effective suppression of multiple reflections is critical for accurate measurement, making MRS an ideal technology solution for a wide range of advanced packaging inspection and metrology applications including QFP, TSOP, BGA, and SMD.

 

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  WaferSense Airborne Particle Sensor™ (APS3)

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  WaferSense Auto Vibration and Leveling Sensor™ (AVLS3)

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  SQ3000™ 3D CMM for Semiconductor Applications

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  WX3000™ Metrology and Inspection System

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  MX3000™ 3D AOI

 

 

 

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