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No: T-3   更新時間:2016/7/20 上午 09:13:12

 

軟性及AMOLED應用之封裝技術

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會議名稱: 軟性及AMOLED應用之封裝技術
時間地點: 8/25 13:00-17:00, 台北南港展覽館5樓 503室
主辦單位: 台灣平面顯示器材料與元件產業協會 (TDMDA)
協辦單位: 台灣顯示器產業聯合總會(TDUA)、工業技術研究院(ITRI)
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聯絡資訊: 台灣平面顯示器材料與元件產業協會(TDMDA)
Tel: 886-3-5916872 黃小姐
e-mail: yuchieh@itri.org.tw
www.tdmda.org.tw 

 

議程表

 

時間 主講人 議題
13:05 - 13:40 何家充 Novel Encapsulation Technology of Foldable AMOLED
13:40 - 14:15 Toshiaki Nonaka High Performance Patterned Dielectrics for Displays and Touch
14:15 - 14:50 Dr. Tatsuya Izumi (泉 達矢) High Gas Barrier Encapsulation Materials for Flexible Electronic Devices
15:10 - 15:45 Dr. Roel Bosch High-End Thin Film Barrier Production for Sheet and Roll-based Applications
15:45 - 16:20 Dr. Helge Kristiansen Highly Uniform Particles for Reliable Contacts to Flexible and Wearable Devices
16:20 - 16:55 Emily Fox Novel Toughened UV Curing Anisotropic Conductive Adhesive

 

主講人

 

 

 

Novel Encapsulation Technology of Foldable AMOLED 

 

何家充

面板整合技術一組 組長

工業技術研究院 影像顯示科技中心

 

講者簡介:

學歷:
國立交通大學 材料所 博士 (2000年)

經歷:
工研院 顯示中心 副組長
工研院 電子所 副理

榮譽/專利/論文等:
Wall Street Journal Technology Innovation Award (2010)
R&D 100 Award (2010)
傑出電機工程師獎(2014)
More than 72 refereed publications and 142 patents

 

 

回議程表

 

 

 

High Performance Patterned Dielectrics for Displays and Touch 

 

Toshiaki Nonaka

Manager of Global Technical Marketing

Merck Performance Materials Japan

 

講者簡介:

Current job:
Global technical marketing for patterning materials

Education:
Master of Science, Material Science, Kyushu University, Japan

Experience:
Development of Ferroelectric liquid crystal, anisotropic diffuser film, Silica based materials and applications, patterning technologies (photo-patterning, printing, ink-jet, etc.)

Awards/Honors/Patents/Publications:
Patent
Half-V Ferroelectric crystal display and device
Isotropic diffuser and application
Photo-patternable Siloxane and derivatives

 

演講大綱:

Over twenty years, a lot of process innovations and new materials have been implemented in the flat display industry. Thanks to those innovations, AM-LCD TVs have driven away CRT by superior image quality and lower cost. In addition these innovations have also generated novel devices such as smart phones and tablet PCs which have totally changed our life styles. And further technology innovations and new types of device can be expected.

One key technology for sophisticated displays is the advanced backplane including thin film transistor (TFT). Silicone, metal oxide and organic semiconductors have been developed and optimized about improving of electron mobility. Dielectric materials play key roles in backplane to support TFT performance. Moreover, dielectric materials can be applied as functional film in devices such as electric insulation, anti-static, light management (Refractive index control), process materials (planarization, bank for OLED inkjet process), protection layer (passivation, barrier) and so on.

Merck’s Silicone based materials (Siloxanes and Silazanes) are polymers specially designed for high performance display applications by higher optical transparency, light management (RI matching), electric characteristics and high durability film (thermal, UV, chemical).
Merck dielectric materials and their unique applications and new processes are introduced in this talk.

 

回議程表

 

 

 

High Gas Barrier Encapsulation Materials for Flexible Electronic Devices 

 

Dr. Tatsuya Izumi (泉 達矢)

Researcher

LINTEC Corporation

 

講者簡介:

Education:
Ph.D in Organic and Polymer Chemistry, Tokyo Institute of Technology

Experience:
- Research of back grinding tapes and dicing tapes for semiconductor fabricating process, ferro- electric liquid crystal materials for display devices, optical functional films for display devices, and high gas barrier encapsulation materials for flexible electronic devices
- Technical Strategy Planning

Awards/Honors/Patents/Publications:
- Paper Award, The Japanese Liquid Crystal Society (1999)
- Young Scientist Presentation Award, The Japan Society of Applied Physics(2005)
- T. Ohashi et. al., “High gas barrier films for flexible OLED”, CMC publication (2016)

 

演講大綱:

Recently, flexible electronic devices have been studied with large intention for implementing bendable, fordable, and wearable devices. The devices utilizing plastic films as a substrate instead of rigid glass could earn flexibility, light-weight and many other advantages. However, when normal plastic films are utilized, gradual deterioration of active parts and electrodes occur due to water vapor penetration because of their poor barrier property. In order to add barrier properties with plastic films, thin inorganic layers such as silicon dioxide and aluminum oxide are fabricated onto plastic surface by sputtering, CVD (chemical vapor deposition) and so on. Although these inorganic components have good barrier property, such layers tend to have defects to permit water vapor penetration. Two approaches are commonly used to achieve higher properties. One is to form single layer with low defect by ALD or PECVD and the other is to form multilayer which is composed of alternately inorganic layers and organic polymer layers. The former layers are too thin to embed particles on the surface of plastic substrate, therefore defects occur relative easily. The latter layers are needed many fabrication process, indicating high cost. In this study, we’ll talk about our gas barrier films, “MS-F series”, with fewer number of layers and lower defects prepared by wet-coating and plasma surface modification technologies. Besides we’ll also discuss about our encapsulate adhesive, “MS-A series” with high gas barrier performance and thermal stability.

 

回議程表

 

 

 

High-End Thin Film Barrier Production for Sheet and Roll-based Applications 

 

Dr. Roel Bosch

Manager Innovations

Meyer Burger (Netherlands) B.V.

 

講者簡介:

Education:
PhD degree in Applied Physics
Eindhoven University of Technology

Experience:
Started in 2002 at Meyer Burger and Manager Innovations since 2012. Experience in Innovation and R&D management and Business Development, driven by industrialization of key technologies like inkjet, PECVD and ALD.

Awards/Honors/Patents/Publications:
PE 2014 Winner for best and most innovatvive manufacturing equipment

 

演講大綱:

Meyer Burger is offering encapsulation technologies based in thin film coating of organic and inorganic layers. The multi-coating process is providing excellent encapsulation properties for the most demanding applications such as OLED. The technology can be applied on rigid and flexible substrates, and the offered system solutions are suitable for both sheet-to-sheet as well as roll-to-roll production. Inorganic coating technologies based on PECVD and ALD will be presented, including the newest R2R spatial ALD tool.

 

回議程表

 

 

 

Highly Uniform Particles for Reliable Contacts to Flexible and Wearable Devices 

 

Dr. Helge Kristiansen

Vice President in Applications

Conpart AS

 

講者簡介:

Helge Kristiansen, PhD
Vice President in Applications, Conpart AS
Adjunct Professor at Norwegian University of Science and Technology (NTNU)

Education:
1996 PhD in Physics. University of Oslo
1988 Master in Solid State Physics. University of Oslo

Research interest:
Kristiansen started working in the area of electronics packaging at Centre for Industrial Research (later SINTEF) in Oslo, Norway, after graduating in 1988. His main interests are materials technology, and instrumentation connected to electrical interconnects and thermal management in different type of micro systems.
He has authored or co-authored more than 100 papers, and 8 patents.

 

演講大綱:

The use of wearable devices is expected to grow rapidly in the years to come. However, there are a number of challenges associated with the manufacturing of such systems, such as the need for high mechanical flexibility with low processing temperatures, finer pitch confronts the technologies for electrical interconnect with new obstacles. The anisotropic conductive adhesive (ACA) is one of the technologies that are of strong interest for wearable devices due to the technology is very cost-competitive compared to both solder and wire bonding techniques. A combination of a bonding temperature of typically 150 0C and high bonding force can cause large local strains in the substrate, which can result in fracture of metal wires and broken interconnects.

One critical factor is the conductive particles' mechanical properties and the relationship between particle deformation and contact resistance. Conpart AS has expertise and state-of-the-art technology with its highly uniform particle development in a lot of details, and the results will be presented at Touch Taiwan.

 

回議程表

 

 

 

Novel Toughened UV Curing Anisotropic Conductive Adhesive 

 

Emily Fox

Key Account Manager

Coll Tech Group

 

講者簡介:

Education:
BS Chemistry
University of Cincinnati, U.S.A.

Experience:
Emily Fox comes from a background as chemical researcher for the automotive electronics, medical device, and electronics industries for adhesives and sealants. She has provided technical support for various users of electrically conductive resins across multiple platforms. Before her current position with The CollTech Group, she was a lead chemist. She has developed novel UV curable silicone and cyanoacrylate systems for various electronics applications.

 

 

回議程表

 

 

 

 

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