No: T-3 中 英 更新時間：2016/7/20 上午 09:13:12
|13:05 - 13:40||何家充||Novel Encapsulation Technology of Foldable AMOLED|
|13:40 - 14:15||Toshiaki Nonaka||High Performance Patterned Dielectrics for Displays and Touch|
|14:15 - 14:50||Dr. Tatsuya Izumi (泉 達矢)||High Gas Barrier Encapsulation Materials for Flexible Electronic Devices|
|15:10 - 15:45||Dr. Roel Bosch||High-End Thin Film Barrier Production for Sheet and Roll-based Applications|
|15:45 - 16:20||Dr. Helge Kristiansen||Highly Uniform Particles for Reliable Contacts to Flexible and Wearable Devices|
|16:20 - 16:55||Emily Fox||Novel Toughened UV Curing Anisotropic Conductive Adhesive|
Novel Encapsulation Technology of Foldable AMOLED 中
High Performance Patterned Dielectrics for Displays and Touch 英
Manager of Global Technical Marketing
Merck Performance Materials Japan
Over twenty years, a lot of process innovations and new materials have been implemented in the flat display industry. Thanks to those innovations, AM-LCD TVs have driven away CRT by superior image quality and lower cost. In addition these innovations have also generated novel devices such as smart phones and tablet PCs which have totally changed our life styles. And further technology innovations and new types of device can be expected.
High Gas Barrier Encapsulation Materials for Flexible Electronic Devices 英
Dr. Tatsuya Izumi (泉 達矢)
Recently, flexible electronic devices have been studied with large intention for implementing bendable, fordable, and wearable devices. The devices utilizing plastic films as a substrate instead of rigid glass could earn flexibility, light-weight and many other advantages. However, when normal plastic films are utilized, gradual deterioration of active parts and electrodes occur due to water vapor penetration because of their poor barrier property. In order to add barrier properties with plastic films, thin inorganic layers such as silicon dioxide and aluminum oxide are fabricated onto plastic surface by sputtering, CVD (chemical vapor deposition) and so on. Although these inorganic components have good barrier property, such layers tend to have defects to permit water vapor penetration. Two approaches are commonly used to achieve higher properties. One is to form single layer with low defect by ALD or PECVD and the other is to form multilayer which is composed of alternately inorganic layers and organic polymer layers. The former layers are too thin to embed particles on the surface of plastic substrate, therefore defects occur relative easily. The latter layers are needed many fabrication process, indicating high cost. In this study, we’ll talk about our gas barrier films, “MS-F series”, with fewer number of layers and lower defects prepared by wet-coating and plasma surface modification technologies. Besides we’ll also discuss about our encapsulate adhesive, “MS-A series” with high gas barrier performance and thermal stability.
High-End Thin Film Barrier Production for Sheet and Roll-based Applications 英
Dr. Roel Bosch
Meyer Burger (Netherlands) B.V.
Meyer Burger is offering encapsulation technologies based in thin film coating of organic and inorganic layers. The multi-coating process is providing excellent encapsulation properties for the most demanding applications such as OLED. The technology can be applied on rigid and flexible substrates, and the offered system solutions are suitable for both sheet-to-sheet as well as roll-to-roll production. Inorganic coating technologies based on PECVD and ALD will be presented, including the newest R2R spatial ALD tool.
Highly Uniform Particles for Reliable Contacts to Flexible and Wearable Devices 英
Dr. Helge Kristiansen
Vice President in Applications
Helge Kristiansen, PhD
The use of wearable devices is expected to grow rapidly in the years to come. However, there are a number of challenges associated with the manufacturing of such systems, such as the need for high mechanical flexibility with low processing temperatures, finer pitch confronts the technologies for electrical interconnect with new obstacles. The anisotropic conductive adhesive (ACA) is one of the technologies that are of strong interest for wearable devices due to the technology is very cost-competitive compared to both solder and wire bonding techniques. A combination of a bonding temperature of typically 150 0C and high bonding force can cause large local strains in the substrate, which can result in fracture of metal wires and broken interconnects.
Novel Toughened UV Curing Anisotropic Conductive Adhesive 英
Key Account Manager
Coll Tech Group