• 李品彥

     

    先進封裝解決方案產品線經理

    美國康寧公司

     

     

    主題

     

    AI時代下康寧在先進封裝的玻璃創新應用

     

    講師簡介

     

    Education:
    Master, Technology Management, University of Illinois at Urbana-Champaign

    Experience:
    Product Line Manager, Advanced Packaging Solutions, Corning Inc.
    Manufacturing Strategy Program Manager, Display, Corning Inc.

     

    演講大綱

     

    In the era of artificial intelligence, glass is set to play a crucial role in advanced packaging. It will help enable ultra-high density interconnections between logic and memory chips, supporting the ever-growing size of AI chip packages. As Moore’s Law reaches its limits and the system-on-chip platform reveals its shortcomings, advanced packaging technologies such as high-bandwidth memory stacking, 2.5D/3D packaging, and fan-out have become essential for continuous performance improvement at a reasonable cost. This talk will highlight Corning’s contributions to creating innovative glass products and addressing practical challenges.