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主題
適用於MicroLED 顯示器的低翹曲解決方案
講師簡介
學歷:
Master of Science in Applied Chemistry, National Chiao Tung University
經歷:
AUO Corp. (TW) ; Smartkem ,Ltd (UK)
Patents : 13+ Patents granted
International Journals : 20+ Journals Published
演講大綱
MicroLED technology holds promise for revolutionizing the display industry by offering superior performance, energy efficiency, durability, and versatility compared to existing technologies. These LEDs emit light when an electric current passes through them, illuminating pixels that emit combinations of red, green, and blue light. This combination, controlled by a driver chips, forms the moving image on the screen. However, overcoming challenges such as heat dissipation, power consumption, and manufacturing costs remains essential for further progress in the big screen revolution.
To address cost problems, placing MicroLEDs on large substrates wired by thick copper interconnections can reduce the complexity of overall manufacturing and be compatible with stepper from the display photo-line. Implementing thick copper is beneficial as it allows MicroLEDs to be driven by higher current with less internal resistance drop (IR Drop). Warpage becomes a major concern as copper thickness increases. State-of-the-art photosensitive polyimide (PS-PI) is not easily able to form a flat surface especially on large dimension substrate.
Smartkem is providing a low-temperature solution, including Active Matrix Circuitry (Organic TFTs) technology, to address warpage problems for MicroLEDs. Additionally, a new method for making low-warpage substrate will be introduced.