• Melbs LeMieux

     

    聯合創辦人/總裁

    美商電子墨水股份有限公司

     

     

    主題

     

    Metal Complex Inks and Films for Additive Manufacturing in Advanced Packaging Applications

     

    講師簡介

     

    Education：
    Postdoctoral Fellow Chemical Engineering 2007 - 2010
    Stanford University Stanford, CA

    Doctor of Philosophy Materials Science and Engineering 2006
    Iowa State University Ames, IA
    Experience：
    2014-Present President · Electroninks, Inc. · Austin, TX
    2010-2014 Co-founder · C3Nano, Inc. · Hayward, CA

    ●As founder and member of C3Nano management team, successfully carried out over $10M in fundraising through three (MIT Clean Energy Prize, Series A, Series B) VC rounds, building company to more than 20 employees, and 12,000 sq. ft. manufacturing facility •
    ●Helped guide the C3Nano company in winning the MIT Clean Energy Prize, as well as over $22M in fundraising.
    ●Developed successful joint development contracts between Electroninks, Inc. and enterprise and smaller companies in the consumer electronics, printed electronics, and biomedical device supply chain.
    •Strong track record of business development and successful joint development contracts with enterprise and smaller companies in the consumer electronics, printed electronics, and biomedical device supply chain at Electroninks.
    ●Frequent technical collaboration with university and industry research teams; gained intimate knowledge of advanced materials and technologies for consumer electronics, cleantech, and medical device industry

     

    演講大綱

     

    ENGLISH (Maximum: 1,000 characters)
    The goal of utilizing conductive inks to augment or compliment traditional metallization approaches in semiconductor packaging applications is to enable ultimate design, functionality and CAPEX flexibility through additive manufacturing, without sacrificing on performance and reliability.

    Traditional metallization processes include the sputtering method, which is a Physical Vapor Deposition process (PVD), and plating, among others. The metal films and patterns are required for EMI shielding, interconnects, thermal management, power delivery and wafer metallization. These processes have certain limitations related to technology factors (limits on panel area, uniform thickness on complex 3D shapes, temperature, and patterning), as well as economic factors (UPH, CAPEX, footprint, and energy usage).

    Alternatively, the technology is seeing a shift to jettable (aerosol and inkjet) or sprayable conductive-based ink for conformal shielding and additive, 3D metallization. This approach brings about substantial total cost of ownership and UPH/throughput advantages that will be reviewed in this talk, as the ink-based processes (spray/jet) does not require vacuum, and relatively low temperatures (at or below 180C in most cases).

    At Electroninks, we have created a line of metal-complex conductive inks for the semiconductor packaging industry. The conductive inks can be printed via various digital printing techniques such as aerosol jet printing, inkjet printing, and spray coating. The inks can be jetted or sprayed on 3D packages, wafers, chips, boards, and housings to provide a high-performance shielding layer that is reasonably priced and has outstanding REL qualities. Previously we have mostly focused on 5-sided shielding via spray coating. Recently we've expanded our capabilities for inkjet and aerosol jet printing techniques. These printing techniques can be used for wafer metallization, antenna on package (AOP) and large area coating.

    In this presentation, we will review film performance parameters including coating thickness uniformity, EMI shielding effectiveness, adhesion, and process parameters. An updated cost model in comparison to PVD that factors in both CAPEX and UPH will be presented. We will discuss the increase in throughput by reducing the spacing between packages and using multiple head printing technology. Finally, to better support clients around the world, we will briefly describe the customer adoption cycle as well as our commercial and partner ecosystem, especially in Taiwan