Panel-level packaging Process Photoresist
Category: Industrial Material - Optolectronic
Exhibitor: EVERLIGHT CHEMICAL INDUSTRIAL CORPORATION
Booth No: L514
Characteristic
Features：
Chemical amplification photoresist
Applied to plating process
Vertical profile and good resolution
Film thickness: 6 ~ 80 μm
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Low Reflectivity ink & LCD black side sealant
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LCD PUR Adhesives
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EK 610 / EOC 360 - Photoresist for Extra Low Temp. Process
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Regenerating slurry for silicon carbide substrate
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MicroLED Photoresist
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Low - Temperature Curable Positive - Tone PSPI EverPI P90 series
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