COF FCCL-38um PI with 8um Copper Film

Category: Industrial Material - Electronic Package

Booth No: L110

Characteristic

This product is one of the main materials of FPC and Rigid-flex board. It adopts roll-to-roll vacuum sputtering and horizontal chemical electroforming process.

The adhesive-free 2-Layer FCCL composed of a flexible insulating layer PI film and sputtered copper can be used in the manufacture of high-end FPC flexible boards, such as: Fine Pitch circuit boards, COF flexible boards, etc.

The substrate is plated with 8um copper layer with a thickness of 38um PI , which is similar to the commonly used COF specification. Single/double-sided optional.

Due to the ultra-thin copper layer, the FPC process time can be shortened and is not easy side etching , which is suitable for the production of thin circuit (Pitch<30um) products.

Menu

COF FCCL-38um PI with 8um Copper Film

Characteristic

Other Products

Products you may be interested in

Highest Rated Products