COF FCCL-38um PI with 8um Copper Film
Category: Industrial Material - Electronic Package
Exhibitor: TOP NANOMETAL CORPORATION
Booth No: L110
Characteristic
This product is one of the main materials of FPC and Rigid-flex board. It adopts roll-to-roll vacuum sputtering and horizontal chemical electroforming process.
The adhesive-free 2-Layer FCCL composed of a flexible insulating layer PI film and sputtered copper can be used in the manufacture of high-end FPC flexible boards, such as: Fine Pitch circuit boards, COF flexible boards, etc.
The substrate is plated with 8um copper layer with a thickness of 38um PI , which is similar to the commonly used COF specification. Single/double-sided optional.
Due to the ultra-thin copper layer, the FPC process time can be shortened and is not easy side etching , which is suitable for the production of thin circuit (Pitch<30um) products.
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