Moldex3D IC Packaging

 

Category: Advanced Equipment - Advanced Packaging & 3D_IC

Exhibitor: CORETECH SYSTEM CO., LTD.(MOLDEX3D)

Booth No: N230

 

Characteristic

 

Plastic Chip Encapsulation is a molding process where chips are being capsulated with Epoxy Molding Compound (EMC) to prevent physical damage or corrosion. This process contains the interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and various control management of process conditions. Due to the complexity of multiple material components, such as EMC, chip, or leadframe, and high wire density, many challenges and uncertainty have been brought to the Chip Encapsulation process. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc. Moldex3D IC Packaging provides a complete series of molding solutions, and supports comprehensive solutions such as : Transfer Molding, Molded Underfill, Capillary Underfill (CUF), Compression Molding, Embedded Wafer Level Package (EMWLP), and No Flow Underfill (NFU) / Non Conductive Paste (NCP). Auto meshing function supports for user to complete encapsulation analysis more easily. User also can adopt advanced manual meshing for more complex component like undercut-shaped lead frame. Read more: https://www.moldex3d.com/products/software/moldex3d-ic-packaging/

 

Other Products

 

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  Moldex3D iSLM

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  Moldex3D

 

 

 

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