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Sputtering Nano Copper(Cu) Conductive materials

Category: Industrial Material - Optolectronic

Exhibitor: TOP NANOMETAL CORPORATION

Booth No: M201

Characteristic

1.Using Roll to Roll(R2R) vacuum sputtering process, we can manufacture nano-grade copper layer materials.

2.Copper thickness ranges from 2um to 6um, suitable for fine pitch (Pitch<30um) layout design.

3.Our sputtering 2L-FCCL can be used for Touch Panel module of wearable device.

4.Product features include: high heat resistance, fine flexural/bending endurance, good peel strength, copper layer uniformity, and dimensional stability.

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