DAP (Inkjet Printing Die Attached Paste)
Category: Advanced Equipment - Advanced Packaging & 3D_IC
Exhibitor: WAFERCHEM TECHNOLOGY CORPORATION
Booth No: M527
Characteristic
Die Attach Paste
-Can print arbitrary thickness and uniformity
-Can print pattern
-Omit laminate process, improve productivity
-Can print on BGA or LF substrate
-Increase high utilization rate of die
Application:
Die to Die/BGA/Lead FrameStackedSolution
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