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DAP (Inkjet Printing Die Attached Paste)

Category: Other

Exhibitor: WAFERCHEM TECHNOLOGY CORPORATION

Booth No: N/A

Characteristic

Die Attach Paste

-Can print arbitrary thickness and uniformity
-Can print pattern
-Omit laminate process, improve productivity
-Can print on BGA or LF substrate
-Increase high utilization rate of die

Application:
Die to Die/BGA/Lead FrameStackedSolution

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