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Transparent Molding Film

Category: Advanced Equipment - Advanced Packaging & 3D_IC

Exhibitor: WAFERCHEM TECHNOLOGY CORPORATION

Booth No: M527

Characteristic

Transparent Molding Film

●Independent research and manufacure in Taiwan
● Transparent feature let 3D IC packaging stack and align easily.
●Excellent adhensive performance, chemical resistance and grinding material.
●Excellent gap filling ability, protect device from moisture damage.
●Low CTE and no die-shift.
●Low Dk & Df.
●Eco-friendly, do not contain toluene.

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