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Mini LED Flip Chip Wafer Direct Mounter

Model: BDM-3000

Category: Manufacturing/Inspection Equipment

Exhibitor: SUZUKI CO., LTD.

Booth No: N/A

Characteristic

BDM-3000 is a mini LED flip chip shooter with technologies of wafer direct ACP dipping, wafer direct flip chip mounting and contamination free chip mounting.
BDM-3000 is designed for mini LED mounting with Anisotropic Conductive Paste (ACP) process which does not require any bonding pressure into chip.
And ACP has the offset correction system of mini LED as called as self-alignment
which is one of chemical reaction. BDM-3000 controls this self-alignment as secondary accuracy correction system.

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