Menu

Home / For Visitors / 2025 Exhibitor Product / 3D Vapor Chamber

3D Vapor Chamber

Category: Electronic Equipment Key Module & Parts

Exhibitor: KOLINK INTERNATIONAL CORPORATION

Booth No: N421

Characteristic

3DVC (Combination of Heat Plate and Heat Pipe Technology)
This technology is an advanced form of the heat plate, where heat pipes extend from the top of the plate, forming interconnected vacuum chambers.
By combining the heat plate's efficient horizontal heat transfer capabilities with the capillary structure advantages of the heat pipes, it further enhances the heat sink’s maximum heat dissipation capacity, delivering superior thermal performance.

Other Products

Products you may be interested in

Highest Rated Products

TOP