Ultra-Soft Thermal Pad
Model: LH-SLP系列
Category: Industrial Material
Exhibitor: LUEN HONG ENTERPRISE CO., LTD.
Booth No: M406
Characteristic
This product features low hardness and excellent resilience, achieving a high compression rate under low pressure with exceptional cushioning properties. It offers a high thermal conductivity, low thermal resistance, strong electrical insulation, and chemical stability. Additionally, its surface has self-adhesive properties, ensuring effective bonding with components and ease of assembly.
Application Industries: Consumer Electronics, 5G Networking, Automotive/EV, Optoelectronic Panel, Green Energy, Power Supply, Medical and Military, Aerospace.
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