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Low R.I. Silicone-encapsulation

Model: LS Series

Category: Micro & Mini LED

Exhibitor: ETERNAL MATERIALS CO., LTD.

Booth No: L401

Characteristic

1. Silicone based encapsulant with customized design and wide viscosity range for different process application
2. Methyl type silicone for better reliability / weatherability
3. Cured encapsulant material can with stand temperature ranging from -50°C to 250°C up
4. Cured encapsulant material with flat and smooth material surface, low hardness and non-tacky feature on surface
5. Cured encapsulant material with high transparency, low modulus, low shrinkage performance and low substrate
6. Special adhesive design for different substrate / package

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