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Laser wafer dicing machine

Category: Electronic Production Manufacturing Equipment

Exhibitor: NTS TECHNOLOGY CO., LTD.

Booth No: L321

Characteristic

Diverse wafer irregular dicing for various materials, including ceramics, silicon wafers, and silicon carbide wafers.

NTS introduces a laser wafer dicing machine capable of various customized wafer cutting processes. With software integration, it also can perform drilling, grooving, and marking according to the customer needed. Applications include silicon wafer irregular dicing, SiC wafer defect cutting, SiN outline cutting, and alignment hole, notch, orientation flat fabrication.

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