OPTEC Laser Lift Off (LLO) Debonding

Model: Light Bench LB2-250-LLO

Category: Semiconductor Package Equipment

Booth No: L327

Characteristic

Careful consideration must be taken to avoid overheating the sample, and degrading the quality of the product. This fact, combined with the relatively low energy threshold required to successfully create the plasma makes excimer lasers perfect candidates for this technique. Indeed, their large homogenized flat top beams, short pulses and low repetition rates guarantee a uniform treatment of the surface whilst avoiding significant temperature gradients.

Optec offers standard products including the Light Bench LB2-250-LLO with either compact or large format excimer laser at 308nm or 248nm, and the fully automated Laser Blade Debonder like LDB-250-LLO with robotic loading & unloading of wafers.

 KEY FEATURES
 Motorized X,Y,Z axes
 308nm laser wavelength
 Up to 45mm beam line length
 >600mJ/cm² on the Off axis vision part
 User friendly softwares
 CAD compatible
 All granite structure
 Class 1 machine

 OPTIONS
 248nm laser wavelength
 Switchable beam line length
 75mm beam line length
 Fully Automated part loading/unloading
 Motorized Theta stages
 Beam profiler on target position
 Energy meter on target position

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OPTEC Laser Lift Off (LLO) Debonding

Characteristic

Other Products

Products you may be interested in

Highest Rated Products