Vacuum Physical Vapor Deposition Tool
Category: Semiconductor Package Equipment
Exhibitor: KINGYOUP OPTRONICS CO., LTD.
Booth No: L321
Characteristic
* for panel size of 300mm SQ ~ 620mm SQ and 12 inch wafer
* coating Ti/Cu Seed Layer, Ti/Cu TGV, Al/Ti/NiV/Au BSM, EMI shielding
* Horizontal or Vertical (optional)
* Rotary cathode design, high utilization
* Integrated Oven degassing and ICP-RIE pre-treatment
* Warpage handling
* High throughput
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