Micro LED on flat stamp

Model: chip-on-flat-stamp

Exhibitor: ULTRA DISPLAY TECHNOLOGY CO., LTD.

Booth No: L210

Characteristic

“Micro LED on flat stamp” is a Mass-Transfer Solution developed by Ultra Display Technology Corp (UDT). UDT provides customized flat mass-transfer stamps by batches to fit different applications and various requirements from manufacturers.

The product consists of a flat stamp body and pitch-allocated micro LEDs on the surface of stamp. Manufacturers or users can directly execute final bonding process by typical flip-chip bonder instead of suffering potential risk of yield-loss from former process steps. As far as manufacturers are concerned, it definitely decreases manufacturing costs and increases yield & production efficiency.