VIB-REC

Exhibitor: TRANZX ADVANCED TECHNOLOGY CO., LTD.

Booth No: N330

Characteristic

Ultra-thin wireless vibration angle monitoring with built-in SD card for offline recording and measurement.
Can be attached to wafer or FOUP to monitor process status.

Precision Vibration Angle Monitoring
1. Semiconductor robotic wafer transfer stability monitoring and measurement.
2. Semiconductor OHT crane status analyzing and monitoring.
3. Long-term monitoring and control of AGV dynamics.
4. Semiconductor equipment internal status monitoring.
5. panel transfer production equipment stability monitoring.
6. FOUP transmission status stability analysis and monitoring.
7. industrial transmission device status monitoring.
8. conveyor belt condition monitoring.

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