Micro LED Substrate
Category: Products and Application
Exhibitor: SJ COMPANY CO., LTD.
Booth No: L525
Characteristic
Our product is a sample with metal wiring and bump metal deposited for the fabrication of interposer substrates for micro LED applications. Currently, we are in the process of development and research, applying indium to these metals. However, we are also capable of utilizing other metals besides indium.
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