Film to Board Die Bonder
Model: FB-20
Category: Mass Transfer
Exhibitor: SAULTECH TECHNOLOGY CO., LTD.
Booth No: L418
Characteristic
#Fast circuit pads alignment and chip bonding.
#Small amount of substrate warpage is tolerable.
#High resolution camera to capture mass amount of images at a time or record designated position for calculation and process optimization purposes.
#Using IR ray to heat up the solder for bonding chips, which only heat up the surface of the substrate, without affecting the IC mounting on the backside of the substrate.
#Camera configured is easy for user to monitor the condition in the oven when adjusting the parameter.
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