FPC Flexible Display
Model: FLAB-02-15
Category: Equipment and Materials
Exhibitor: AEROTRANSTECHNOLOGY CO., LTD.
Booth No: M408
Characteristic
In the full laser process, MiniLED chips are transferred onto the FPC and bonded using laser, achieving high bonding strength. The brightness remains uniform when flattened, and the curvature radius can reach up to one centimeter when bent.
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