TIM
Model: SEMICOSIL SERIES
Category: Advanced Packaging & 3D IC Material
Exhibitor: TBI MATERIALS CO., LTD.
Booth No: L201
Characteristic
1.Excellent thermal conductivity (thermal conductivity: 0.5–4.8 W/mK)
2.Maintains consistent physical properties and performance even under extreme temperatures (-45°C to +150°C).
3.Outstanding flow and processing properties, allowing for easy dispensing.
4.Good wetting properties, enabling tight bonding with components.
5.Low volatile content.
6.Can provide strong and flexible adhesion without further fixation.
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