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IC/MEMS PACKAGE

Model: SEMICOSIL SERIES

Category: Advanced Packaging & 3D IC Material

Exhibitor: TBI MATERIALS CO., LTD.

Booth No: L201

Characteristic

1.Reduces mechanical and thermal stresses.
2.Highly stable within temperature ranges from -90°C to above 200°C (specialized series can withstand up to 230°C).
3.Thermally conductive.
4.Low energy curing, cures rapidly.
5.Improves heat dissipation (thermal management).
6.Does not exude oil.
7.Resistant to combustion, resistant to oils.
8.High tear strength.
9.Compressible.
10.Maintains low storage modulus over a wide temperature range.

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