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High thermal conductivity and high toughness ceramic aluminum nitride base plate

Category: Electronic Production Manufacturing Equipment

Exhibitor: OKAMOTO OPTECH CO., LTD.

Booth No: M529

Characteristic

■The exclusive material "ThermalniteⓇ" (fibrous aluminum nitride single crystal) developed by "U-MAP" and the glass ceramic flake technology of "Okamoto Glass" create a new composite material
■High thermal conductivity 『200 W/m·K or more』,
Better than ordinary aluminum nitride substrates
■Increase mechanical toughness,
"2 times 5.5 MPa・m1/2"
■Fiber shape effectively forms a heat channel,
Very small amount can quickly conduct heat

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