Corning Semiconductor Technologies and Solutions
Category: Advanced Packaging & 3D IC Material
Exhibitor: CORNING DISPLAY TECHNOLOGIES TAIWAN CO., LTD.
Booth No: N904
Characteristic
The Semiconductor Technologies & Solutions business delivers an innovative and diverse set of glass and crystal components, and advanced optical sub-assemblies for modern lithography scanners, optical inspection systems, and advanced packaging substrates.
Our products help customers deliver increasingly demanding functionality and form factor requirements for consumer devices and the Internet of Things applications. The inherent properties of glass – high optical transmission, excellent electrical performance, tight geometrical tolerances, and pristine surface quality – along with Corning’s ability to offer different compositions in a wide range of coefficients of thermal expansion (CTE) and refractive indices, position Corning glass as the premier material for next-generation semiconductors and immersive communications applications.
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