Wafer grooving machine
Category: Semiconductor Package Equipment
Exhibitor: NTS TECHNOLOGY CO., LTD.
Booth No: M429
Characteristic
Application :
Wafer laser dicing and grooving 、 Low-K wafer laser grooving.
Features :
1. Adjust wafer compatibility sizes to meet customer requirements.
2. Automatic focus and alignment production, manual automatic switching function.
3. Nanosecond and picosecond UV lasers can be used to meet customer needs.
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