Spin Coater/Developer
Model: ATOM 6500C、ATOM 6500D
Category: Equipment and Materials
Exhibitor: HERMES-EPITEK CORP.
Booth No: M412
Characteristic
￭ Photoresist coating: Dewatering baking, HMDS coating, photoresist coating, thick PI coating, and soft baking
The photoresist is sprayed on the wafer from the nozzle, and the rotating stage is being used to drive the wafer to rotate at a high speed, and then the photoresist will be evenly distributed on the wafer.
￭ Development: baked, developed, hard baked after exposure
The developer is sprayed on the wafer from the nozzle, and the photoresist is developed and rinsed with DIW (deionized) water, and then the water on the wafer will be spin-dried.
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