KYZEN Cleaning Total Solutions
Category: Net Zero Emissions Solutions
Exhibitor: EZBOND CHEMICAL CO., LTD.
Booth No: L222
Characteristic
KYZEN is a global leader in developing high-performance, innovative cleaning process solutions for the electronic manufacturing, metal surface treatment, and advanced packaging applications. The company has been consistently awarded nearly 100 industry awards across various categories for 15 consecutive years, including recognition for new product innovation, environmental initiatives, and outstanding customer service.
Following the EU ROHS and WEEE regulations, KYZEN offers a range of advanced cleaning agents that provide efficient and innovative cleaning solutions. These products find applications in:
1. PCB solder flux cleaning solutions
2. Wafer bumping/CoWos - WS (water-soluble), ROSIN (rosin-based), and NC (no-clean) solder flux cleaning
3. Flip Chip - WS (water-soluble) and NC (no-clean) solder flux cleaning
4. SiP/PLP - WS (water-soluble) and NC (no-clean) solder flux cleaning
5. Ceramic/molded package cleaning
6. Solder wire bonding/Cu Clip cleaning
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